英语新闻丨华为发布高端芯片

First high-performance processor to adopt the company's LogicFolding

首款采用“逻辑折叠”技术的高性能处理器亮相

Huawei Technologies Co on Monday unveiled its latest flagship chip, the Kirin 9050 Pro, marking the company's first new high-performance Kirin processor launch at a flagship event since its Mate 40 smartphones global debut six years ago.

华为技术有限公司（Huawei Technologies Co）周一发布最新旗舰芯片——麒麟9050 Pro。这是自六年前华为Mate 40系列智能手机全球发布以来，公司首次在旗舰级活动上推出全新的高性能麒麟处理器。

The chip, which powers Huawei's newly released Mate XT 2 tri-fold smartphone, is the industry's first high-performance processor to adopt the company's LogicFolding technology. The approach rearranges logic units within a single chip into layered stacks — akin to converting a single-floor layout into a duplex — and adds vertical interconnect channels that function like "elevators" to shorten signal paths and reduce latency.

该芯片搭载于华为最新发布的Mate XT 2三折叠智能手机中。据介绍，麒麟9050 Pro是业界首款采用华为“逻辑折叠”技术的高性能处理器。这一技术通过将单个芯片内部的逻辑单元重新排列为分层堆叠结构——类似于将单层建筑改造成复式结构——并增加类似“电梯”的垂直互连通道，从而缩短信号传输路径，降低延迟。

The result is a 42 percent improvement in overall device performance over the previous generation chip, Huawei said.

华为表示，与上一代芯片相比，搭载麒麟9050 Pro的设备整体性能提升了42%。

Yu Chengdong, Huawei's executive director and chairman of the terminal business group, described the chip at the Guangzhou, Guangdong province launch event as "super fast, intelligent and cool" — calling it the most powerful Kirin chip to date.

在广东省广州市举行的发布活动上，华为常务董事、终端业务集团董事长余承东将这款芯片形容为“速度超快、智能十足、酷炫强大”，并称其为迄今为止性能最强的麒麟芯片。

The Kirin 9050 Pro delivers substantial improvements in large-file loading, multitasking, rendering performance and on-device artificial intelligence capabilities, Huawei said.

华为表示，麒麟9050 Pro在大文件加载、多任务处理、图形渲染性能以及端侧人工智能能力方面均实现了显著提升。