Strengthening the US-Japan Alliance Through Semiconductor and AI Partnerships

Cooperation in semiconductors and artificial intelligence is vital to the United States–Japan alliance. Two developments demonstrate the potential of this partnership: the Rapidus-IBM effort to produce advanced two-nanometer chips in Hokkaido, and Japan’s decision to be the first foreign partner in the Trump administration’s Genesis Mission for AI-powered research and development.

Join Hudson Institute’s Japan Chair for a conference to showcase and strengthen US-Japan cooperation in semiconductors and AI. US Deputy Under Secretary of Commerce for Innovation and Engagement Bill Guidera will deliver an opening keynote before engaging in a fireside chat with Senior Fellow William Chou.

Later, Rapidus CEO Atsuyoshi Koike, IBM CEO Arvind Krishna, and Director-General Kazumi Nishikawa of the Japanese Ministry of Economy, Trade, and Industry will deliver remarks. They will participate in a panel discussion and take questions from the audience.