Microsoft Maia 300 Puts 288GB of HBM4 at 18TB/s on an N2P Chiplet and 96 Accelerators in a 167kW Rack

Microsoft unveiled Azure Maia 300 today at the OCP Global Summit, the third generation of its in-house inference accelerator and the first built as a multi-chiplet part. Each accelerator pairs a TSMC N2P compute die with eight HBM4 stacks for 288GB of memory at 18TB/s inside a 950W TDP, and a Maia 300 rack holds

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